Brand：Frontier Semiconductor
Model：Film Adhesion
Film Adhesion
Film adhesion testing of thin films and stacks on substrates for material evalsuation
3DIC TSV and BWS TTV
Film Stress
FEOL Electrical Characterization
Thin wafer metrology
Film Adhesion
Film adhesion testing
of thin films and stacks on substrates
for material evalsuation.
FSM offers two techniques suitable for low and medium adhesion strength tests.
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Contact our application team immediately: 021-37018108, info@qianmengwl.cn
Tel：86-021-37018108
Fax：86-021-57656381
Email：info@qianmengwl.cn
Address：Room 301, 28 Songjiang Hi-tech park, 518 Xinzhuan Road, Songjiang District, Shanghai
